Encapsulated modular boost converter and method of manufacture therefor
US5874826A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1997 |
| Grant date | Feb 23, 1999 |
| Priority date | — |
| Expiry date | Oct 29, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A boost converter module, a method of manufacturing the module and a power converter employing one or more of the same. In one embodiment, the boost converter module includes: (1) a power switch, (2) first and second snubber diodes series-coupled between the power switch and a converter output, (3) a snubber capacitor and a boost diode series-coupled across the second snubber diode and (4) an encapsulant substantially surrounding the power switch, the first and second snubber diodes, the snubber capacitor and the boost diode to join the power switch, the first and second snubber diodes, the snubber capacitor and the boost diode into an integrated package, the integrated package having: (4a) a control input coupled to the power switch, (4b) a power input coupled to the power switch, (4c) a snubber inductor input, coupled to a node between the snubber capacitor and the boost diode and (4d) a power output coupled to the converter output.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.