Heat sink for auxiliary circuit board
US5875097A · kind A · utility
17Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 9, 1997 |
| Grant date | Feb 23, 1999 |
| Priority date | — |
| Expiry date | Jun 9, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The heat sink is mounted on a back plane of an auxiliary circuit board and the auxiliary circuit board is mounted on a main circuit board. In one embodiment, the heat sink is planer and extends between parallel auxiliary and main circuit boards. A finned heat dissipating member is at one side of the planar portion. Mounting pins in channels mount the heat sink to the main circuit board. The second embodiment is unshaped and stands on edge to mount the auxiliary circuit board perpendicular to the main circuit boards. Mounting pins in channels of the second embodiment likewise mount the heat sink to the main circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.