Electronic component
US5875099A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 1998 |
| Grant date | Feb 23, 1999 |
| Priority date | — |
| Expiry date | May 21, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/1014
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An electronic component suppresses stray capacitance and exhibits a high electromagnetic shielding effect, and eliminates flowing of a conductive agent into inappropriate areas and occurrence of a poor electrical connection. Electronic-component devices are mounted on an insulating substrate having input and output electrodes and a ground electrode. Then, a metallic cap is bonded and sealed onto the substrate via an insulating layer having holes formed therein so as to cover the electronic-component devices. A conductive layer connected to the ground electrode is disposed on part of the cap-mounting portion of the substrate and positioned at a level higher than the insulating layer so that the metallic cap is electrically connected via the conductive layer to the ground electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.