Optoelectronic component and method for the manufacture thereof

US5875205A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Werner Spaeth · Holzkirchen, DE
• Wolfgang Gramann · Regensburg, DE
• Hans-Ludwig Althaus · Lappersdorf, DE
• Ralf Dietrich · Munich, DE

Key dates

• Filing date: Feb 12, 1997
• Grant date: Feb 23, 1999
• Expiry date: Feb 12, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01S5/0683
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

In an optoelectronic component having a laser chip as a light transmitter and a lens coupling optics for defined emission of radiation generated in the laser chip, the lens coupling optics is arranged immediately in front of the laser chip and is adjusted and fixed in stable fashion in a simple way. The component is rationally manufactured in a wafer union. The laser chip is arranged on a common carrier between two carrier parts whose lateral surfaces neighboring the resonator faces of the laser chip are provided with mirror layers, and that are inclined at an angle of 45.degree. relative to the resonator faces. Thus the radiation generated in the laser chip is directed nearly perpendicularly upward to the surface of the common carrier and the lens coupling optics is arranged on at least the one carrier part such that the radiation generated in the laser chip impinges this lens optics nearly perpendicularly.