Method of forming solder-holding clips for applying solder to connectors
US5875546A · kind A · utility
16Cited by
15References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 1996 |
| Grant date | Mar 2, 1999 |
| Priority date | — |
| Expiry date | Oct 7, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An array and method of forming an array of solder-holding clips is provided, suitable for fabrication by automatic progressive stamping techniques, and for ganged application to a corresponding array of terminal pins of an electrical device, for soldering such pins directly to the conductive pads or internally plated holes of a substrate, or to provide a lead connecting such pins to a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.