End point polishing apparatus and polishing method
US5876265A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 26, 1997 |
| Grant date | Mar 2, 1999 |
| Priority date | — |
| Expiry date | Sep 26, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/49085
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus of the present invention comprises an amplifier for amplifying a first signal being input from the vibration detecting device attached on a second surface plate to then output a second signal, a gain indicator for determining unsuitableness of a gain of the amplifier based on a magnitude of the second signal output from the amplifier and then indicating correction of said gain, a gain adjuster for adjusting the gain of the amplifier based on a gain correction signal output from the gain indicator, a polishing end-point analyzing portion for determining an end-point of polishing based on change in the second signal, and a control portion for terminating drive of the first surface plate based on a polishing end-point signal being output from the polishing end-point analyzing portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.