Polishing pad with controlled release of desired micro-encapsulated polishing agents
US5876266A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1997 |
| Grant date | Mar 2, 1999 |
| Priority date | — |
| Expiry date | Jul 15, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/34
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A desired reagent is delivered to a workpiece undergoing a chemical mechanical polishing process with a chemical mechanical planarization apparatus. A slurry and polishing pad are provided for the polishing process. Reagent containing microcapsules are also provided, the microcapsules encapsulating a desired reagent. The workpiece is polished with a combination of the slurry, the polishing pad, and the microcapsules, wherein the encapsulated reagents are controllably released during the polishing step via manipulation of a polishing parameter. In one embodiment, the microcapsules are included in the slurry. In an alternate embodiment, the microcapsules are embedded within the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.