Patent · US Expired

Method for manufacturing a ceramic multilayer substrate for complex electronic circuits

US5876538A · kind A · utility

7Cited by

8References

7Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Klaus Steinle · Sindelfingen, DE
Claudio De La Prieta · Stuttgart, DE
Manfred Moser · Dachau, DE
Annette Seibold · Rutesheim, DE

Key dates

Filing date	Feb 26, 1997
Grant date	Mar 2, 1999
Priority date	—
Expiry date	Feb 26, 2017

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/435
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Ceramic multilayer substrates as circuit supports for complex electronic circuits wth integrated capacitors are manufactured by printing capacitor structures, using the screen printing process, directly onto a first green ceramic film. The first green ceramic film with the printed structures is arranged in a stack with further green ceramic films, laminated, and fired. During lamination of the ceramic films, the printed structures are pressed into the ceramic films so that after firing, a multilayer substrate with integrated capacitors results.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.