Plasma enhanced OMCVD of thin film coating for polymeric fibers
US5876808A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 1997 |
| Grant date | Mar 2, 1999 |
| Priority date | — |
| Expiry date | Mar 13, 2017 |
Classification
- Technology area (CPC D)Textiles; Paper
- CPC primaryD06M11/58
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A plasma enhanced chemical vapor deposition process for depositing a titanium nitride film on a polymeric substrate is provided, the process including placing the polymeric substrate within a chemical vapor deposition chamber evacuated to a pressure within a range of from about 0.1 Torr to about 10 Torr, heating the polymeric substrate to a temperature within a range of from about 150.degree. C. to about 250.degree. C., introducing a vaporized organometallic compound and ammonia gas into the chamber, generating a plasma within the chamber, and, maintaining the polymeric substrate within the chamber for a time sufficient for a layer of titanium nitride to deposit upon the polymeric substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.