Molded stressed-skin panels
US5876835A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 1996 |
| Grant date | Mar 2, 1999 |
| Priority date | — |
| Expiry date | Nov 27, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2495
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Stressed-skin panels are provided having internal open-cell grids molded from material such as fibers, and methods and apparatus for the production thereof are disclosed. The invention utilizes a porous screen having a plurality of elastomeric pads spaced apart thereon. Fiber dispersed in fluid is introduced into the apparatus and over and around the pads. Pressure exerted thereon expels fluid through the screen and consolidates the fibers to form a panel. The pads are designed and constructed in a manner so as to consolidate the fiber mat located below the pads compressed by the pressure, so that the finished panel includes an integrally-molded flange. The height, shape and/or spacing of the pads in the present invention advantageously provide improved mold release and greater resistance to compression set after repeated use. The pads provide greater consistency and improved quality in the flange formation on the panels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.