Glass/Metal package and method for producing the same
US5877042A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1996 |
| Grant date | Mar 2, 1999 |
| Priority date | — |
| Expiry date | Aug 28, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of producing a glass/metal package where a glass portion of the package is built up around a provided leadframe (10) using applications of solderable and glass pastes (20) which are subsequently fired (30). The glass paste and leadframe are chosen to have similar coefficients of expansion and the leadframe is pretreated to degasify and control oxidation of the metal to promote glass adhesion to the leadframe and prevent microcracking at a glass/metal interface. A seal ring is applied to the glass paste (40) and a lid is attached to the seal ring (50). The package is used to provide an sealed inert internal environment for sensitive electronic components such as a piezoelectric element. The package may be configured for leaded or surface mounting (60).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.