Compositions and insulation bodies having low thermal conductivity
US5877100A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 1996 |
| Grant date | Mar 2, 1999 |
| Priority date | — |
| Expiry date | Sep 27, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01J13/00
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present invention relates to particulate compositions having improved thermal conductivity values. An embodiment of the present invention is a particulate composition which under a 103421 Pa load, at 20.degree. C., and at a pressure (P) within the range of 133.322-13332.2 Pa, in Nitrogen, has: a packing density of less than or equal to 160 kg/m3, and a Thermal Conductivity (TC) at 133.322-1333.22 Pa of less than or equal to (0.260 lnP+4.53) milliWatt/meterK (mW/m.multidot.K) and a TC at 1333.22-13332.2 Pa of less than or equal to (0.824 lnP+0.47) mW/m.multidot.K. A preferred particulate composition is a gel composition. Also disclosed are insulation bodies comprising the particulate compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.