Encapsulated printed circuit assembly and method and manufacturing the same
US5877545A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 1997 |
| Grant date | Mar 2, 1999 |
| Priority date | — |
| Expiry date | Mar 21, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/284
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A PCMCIA card for use in electronic equipment includes a glass laminate circuit board including a pair of substantially planar, oppositely disposed component-mounting surfaces. Printed circuitry is designed and arranged on at least one of the component-mounting surfaces. At least one integrated circuit package is assembled onto the printed circuitry and has a length dimension direction and a shorter, width dimension direction. In order to reduce the stresses which the integrated circuit package is subjected to during handling of the PCMCIA card, the integrated circuit package is arranged on the circuit board such that the integrated circuit package length dimension direction is substantially parallel to the width dimension direction of a cooperating metal case which is part of the PCMCIA card. The assembled circuit board is encapsulated with a flexible potting compound and enclosed within the metal case to complete the PCMCIA card assembly. In order to further reduce the loading on the integrated circuit component and circuitry, the circuit board thickness does not exceed 0.79 mm (1/32 inch). The circuit board may be fabricated from a flexible polymer based flex circuit material to…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.