Film carrier for fine-pitched and high density mounting and semiconductor device using same
US5877559A · kind A · utility
36Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 6, 1996 |
| Grant date | Mar 2, 1999 |
| Priority date | — |
| Expiry date | Aug 6, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a film carrier with a conductive circuit formed, an opening is formed in a particular position relative to where the conductive path is to be formed. The opening is a through-hole, filled with a conductive material to form a conductive path. The conductive circuit has a concave face, provided according to certain formulae. The film carrier can cope with a fine-pitched and highly dense mounting, while prohibiting pulling out of the conductive path by an external force. The film carrier does not suffer from fallout of the conductive path, and has increased electrical connection reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.