Plate and column type semiconductor package having heat sink
US5877561A · kind A · utility
18Cited by
14References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 18, 1996 |
| Grant date | Mar 2, 1999 |
| Priority date | — |
| Expiry date | Nov 18, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved plate and column type semiconductor package has a heat sink embedded in a plate, which prevents bending of leads or paddle. The plate includes a plurality of leads and a heat sink which are embedded therein, whereby the mounting of the semiconductor package on the printed circuit board is made easier. A semiconductor chip is attached to the heat sink of the plate and a plurality of metal wires electrically connects a plurality of the leads of the plate and the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.