Solder-ball supplying apparatus
US5878911A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 1997 |
| Grant date | Mar 9, 1999 |
| Priority date | — |
| Expiry date | Jun 23, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3478
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder-ball supplying apparatus for a ball-grid array (BGA) IC packaging process is provided, which can supply solder balls of diameters from 0.5 mm to 1.0 mm at a preset amount to a solder-ball implanting machine. The solder-ball supplying apparatus is fully automated, in which vacuum means is used to suck out a preset amount of solder balls from a storage tank that are to be supplied. Rotary pneumatic cylinder means in conjunction with valve means are used to control the conveyance of the solder balls to the container. This solder-ball supplying apparatus can supply solder balls fast and in a non-contact manner that can prevent damage to the solder balls being supplied. It is fully automated so that manual labor is reduced and the quality of the solder balls being supplied can be assured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.