Method of fabricating an electronic circuit device and apparatus for performing the method
US5878943A · kind A · utility
30Cited by
2References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 1996 |
| Grant date | Mar 9, 1999 |
| Priority date | — |
| Expiry date | Nov 19, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1157
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the members are aligned in an oxidizing atmosphere. Then the solder material is heated in a nonoxidizing atmosphere to melt the solder and bond the members. Cleaning of the solder material or bonding pad is performed by sputter-cleaning, laser cleaning, mechanical polishing, or cutting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.