Process for semi-solid forming of thixotropic aluminum-silicon-copper alloy
US5879478A · kind A · utility
15Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1997 |
| Grant date | Mar 9, 1999 |
| Priority date | — |
| Expiry date | Feb 26, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C21/04
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention relates to an aluminum alloy for thixoforming with the composition (by weight): Si: 5%-7.2% Cu: 1%-5% Mg<1% Zn<3% Fe<1.5% other elements<1% each and<3% in total, with % Si<7.5-% Cu/3, which, when reheated to the semisolid state to the point at which a liquid fraction ratio between 35 and 55% is obtained, has an absence of non-remelted polyhedral silicon crystals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.