Process for antistatic treatment of resin and antistatic resin composition
US5879589A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 1997 |
| Grant date | Mar 9, 1999 |
| Priority date | — |
| Expiry date | Jan 31, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K9/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a process for the antistatic treatment of a resin which comprises dispersing the following organically-modified layer silicate in a synthetic resin in the state that the following specific state is attained. A novel resin composition is provided, comprising an organically-modified layer silicate compound having a specific volume resistivity of not more than 1.times.10.sup.13 .OMEGA..multidot.cm dispersed in a synthetic resin in a proportion of from 2 to 30 parts by weight based on 100 parts by weight of said synthetic resin in the state that (1) a primary aggregate and/or a secondary aggregate having a short axis length of not more than 500 nm is formed and (2) the average minimum interparticle distance is not more than 500 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.