Method and apparatus for encapsulating electronic components
US5879598A · kind A · utility
25Cited by
5References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 12, 1996 |
| Grant date | Mar 9, 1999 |
| Priority date | — |
| Expiry date | Aug 12, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3406
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A centrifuge (18) is used to introduce a fluid, particularly a viscous fluid such as an encapsulating resin, into a cavity in a container (10), particularly a small cavity such as the inside of an electronic component housing. Measured quantities of the fluid are placed in dispensing vessels (28) in the centrifuge opposite the containers to be filled. The dispensing vessels have openings (36) through which the fluid can flow when centrifugal force is applied. On the application of this force, all the fluid flows out of the vessels into the containers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.