Adhesive-filler film composite
US5879794A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 8, 1996 |
| Grant date | Mar 9, 1999 |
| Priority date | — |
| Expiry date | Nov 8, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/699
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of preparing an adhesive composite is provided where a fluoropolymer having nodes and interconnected fibrils with a void volume formed from the node and interconnected fibril structure is at least partially filled with a paste formed from a thermoset or thermoplastic adhesive and a particulate vapor phase formed inorganic filler having uniform surface curvature, sufficient adhesive and filler are present to provide a composite having between about 5 to about 40 volume percent polymeric substrate, 10-95 volume percent adhesive and filler imbibed within the voids of said substrate and 5 to 85 volume percent inorganic filler is contained within the composite. In the composite, the ratio of mean flow pore size to largest particle size is at least above 0.7; or the ratio of mean flow pore size to average particle size is greater than 1.5; or the ratio of minimum pore size to average particle size is at least above 0.8; or the ratio of minimum pore size to largest particle size is at least above 0.4.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.