Method of bumping substrates by contained paste deposition
US5880017A · kind A · utility
64Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 1997 |
| Grant date | Mar 9, 1999 |
| Priority date | — |
| Expiry date | Aug 25, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.