Radiation shielding of three dimensional multi-chip modules
US5880403A · kind A · utility
65Cited by
7References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 1997 |
| Grant date | Mar 9, 1999 |
| Priority date | — |
| Expiry date | Jan 24, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.