Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism
US5880930A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 18, 1997 |
| Grant date | Mar 9, 1999 |
| Priority date | — |
| Expiry date | Jun 18, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0033
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A EMI shield which includes a heat sink and a compression coupling. A top housing formed of electrically conductive material is placed over a circuit board containing electronic devices and is electrically coupled to an electrical ground through contact along the length of a conductive strip which is connected to an electrical ground. A bottom housing formed of electrically conductive material is connected to an electrical ground through electrical contact along the length of a conductive strip located on the bottom of the circuit board so as to form a EMI shielding enclosure. The top housing is formed of thermally conductive material and includes extended surfaces for conducting heat away from the electronic devices contained below the top housing. In addition, the bottom housing is formed of thermally conductive material so as to form a thermally conductive enclosure which acts as a heat sink, effectively cooling the electronic devices contained therewithin. A compression coupling mechanism which uses springs to press the top housing towards the bottom housing gives consistent electrical contact between a microprocessor and a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.