Assembly of an optical component and an optical waveguide
US5881190A · kind A · utility
29Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 1997 |
| Grant date | Mar 9, 1999 |
| Priority date | — |
| Expiry date | May 8, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0234
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A silicon-on-insulator chip has a location recess formed therein for receiving a laser diode. The location recess includes two non-parallel location surfaces adapted to abut against two reference surfaces formed on the laser diode. The abutment of the location surfaces against the reference surfaces enables a laser emission area of the laser diode to be accurately aligned with a rib waveguide formed on the silicon-on-insulator substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.