Chemical mechanical polishing pad slurry distribution grooves
US5882251A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 1997 |
| Grant date | Mar 16, 1999 |
| Priority date | — |
| Expiry date | Aug 19, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided is a chemical mechanical polishing pad having grooves in its polishing surface which have a sub-surface cross-sectional span greater than the grooves' surface opening span. In this way, the edges of the groove are undercut. This provides both increased groove volume for a given pad surface area and groove depth, and variable flexibility in the polishing pad's surface. Grooves in pads of the invention also typically include a neck region at the top of the groove, where the groove side walls are substantially parallel. This provides a margin for the pad to wear during polishing without affecting the pad's surface area. The invention also provides a method and apparatus for cutting grooves in a chemical mechanical polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.