Method of applying a security element to a substrate
US5882463A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 13, 1996 |
| Grant date | Mar 16, 1999 |
| Priority date | — |
| Expiry date | Mar 13, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB42D2035/20
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
In a method of transferring a security element which is in the form of a laminate with a carrier foil and with a thermally activatable adhesive layer for connection to a substrate onto a document the adhesive layer is brought into contact with the substrate and locally heated by the supply of heat energy through the laminate. After the adhesive layer cools if necessary the carrier foil can be pulled off the substrate, in which case the carrier foil, at the locations adhering to the substrate, is detached from the rest of the laminate and the laminate tears along the boundary between the adhering and the non-adhering locations so that only the adhering locations of the laminate remain behind on the substrate. In particular a laser beam or an array of laser or light emitting diodes is suitable for the supply of heat energy. The laminate preferably has diffraction structures or layers producing optical interference effects. The alignment of the laminate and the substrate can be effected in accurate register relationship.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.