Resin molding apparatus
US5882692A · kind A · utility
2Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1997 |
| Grant date | Mar 16, 1999 |
| Priority date | — |
| Expiry date | Mar 31, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/228
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A gate portion constituting a gate of a resin molding die is made of a hard alloy having a hardness greater than the predetermined hardness in the iron-based hard alloy used to from a cavity block and a center block. Opposing surfaces of the cavity block halves include a silicone rubber layer at least at the portions thereof which contact portions of the lead frame in a semiconductor encapsulation molding apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.