palladium layers deposition process

US5882736A · kind A · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Ludwig Stein · Berlin, DE
• Hartmut Mahlkow · Berlin, DE
• Waltraud Strache · Berlin, DE

Key dates

• Filing date: Aug 20, 1997
• Grant date: Mar 16, 1999
• Expiry date: Aug 20, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/072
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A formaldehyde-free chemical bath containing a palladium salt, a nitrogenated completing agent, and formic acid or formic acid derivatives, at a pH of greater than 4 and a process of using the chemical bath for depositing on a metal surface an adhesive, permanently glossy, bright palladium layer with few pores. The metal surface may be pretreated in a cementation palladium bath. The metal surface contains at least one of copper, nickel, and cobalt, as well as their alloys with one another and/or with phosphorus or boron.