Adhesive compositions with durability under conditions of high humidity
US5883193A · kind A · utility
80Cited by
11References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 1, 1997 |
| Grant date | Mar 16, 1999 |
| Priority date | — |
| Expiry date | Jul 1, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J4/06
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A thermosettable adhesive composition that includes a monomeric or partially polymerized composition that includes at least one polymerizable acrylic or methacrylic acid ester of a non-tertiary alcohol, a thermosettable epoxy resin, an amine curative, a silane coupling agent, and a chelating agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.