Device with power semiconductor components
US5883431A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 1997 |
| Grant date | Mar 16, 1999 |
| Priority date | — |
| Expiry date | May 12, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device with power semiconductor components includes, in combination: a stack alternately comprising at least one power semiconductor component and at least one heatsink to dissipate heat and to provide an electrical connection, at least a first system for clamping the power semiconductor components, at least a second system for clamping components protecting the power semiconductor components, at least one spacer for insulating the semiconductor components from the framework of the various modules and at least one conductive block replacing heatsinks that are rendered unnecessary by the arrangement chosen for the inverter and auxiliary chopper functions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.