Method and apparatus for packaging articles
US5884456A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 5, 1997 |
| Grant date | Mar 23, 1999 |
| Priority date | — |
| Expiry date | Nov 5, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65B11/50
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for assembling a blister package. The apparatus includes a packaging jig having a plurality of perimeter locating pins that are arranged to extend around the perimeter of the package when assembled on the jig. In a first aspect, the jig also includes an interior locating pin positioned inwardly from the perimeter locating pins to register a blister and possibly an article during assembly. In a second aspect of the invention, the jig further includes a plurality of exterior locating pins positioned outwardly from the perimeter locating pins to register an article to be packaged during assembly. The blister package is assembled by sequentially positioning the display cards, blister, and article on the jig such that the locating pins register the various components. The display cards are positioned within the perimeter locating pins, the blister is positioned between the perimeter locating pins and the interior locating pin, and the article is positioned between the interior locating pin and the exterior locating pins. Once positioned on the jig, the components are interconnected using conventional methods and apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.