Cooling device for central processing unit module
US5884692A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 1998 |
| Grant date | Mar 23, 1999 |
| Priority date | — |
| Expiry date | Jun 15, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling device for a CPU consists of an attachment plate in contact with the CPU, a heat sink in contact with the attachment plate, a spring plate having two retention legs extending through the heat sink and the attachment plate, a fan mounting plate mounted with a fan and fixedly engaging with the heat sink and a mounting rod mounted between the fan mounting plate and the spring plate to compress the spring plate against the heat sink. The mounting rod is operable to move between first and second positions wherein at the first position, the mounting rod compresses the spring with a large force to cause the retention legs thereof to move away from each other and disengage with the attachment plate, and at the second position, the mounting rod compresses the spring plate with a small force to cause the retention legs thereof to move toward each other and engage with the attachment plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.