Ultrasonic vibration bonding chip mounter
US5884831A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 1997 |
| Grant date | Mar 23, 1999 |
| Priority date | — |
| Expiry date | Apr 24, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0812
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An ultrasonic vibration bonding chip mounter includes a chip carrying unit arranged above a chip supply unit, a prealignment unit and a mounting unit which are arranged in a row and having a movable table which can move back and forth in a direction parallel to a direction where these units are arranged, a pick-up unit, attached to the movable table, for transferring a chip from the chip supply unit to the prealignment unit, and an ultrasonic vibration bonding unit, attached to the movable table, for transferring the chip from the prealignment unit to a mounting unit so that the chips are transferred from the chip supply unit to the prealignment unit and further to the mounting unit by the reciprocation of the movable table one by one.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.