Method of bonding metal plates, apparatus therefor and hot strip mill
US5884832A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1996 |
| Grant date | Mar 23, 1999 |
| Priority date | — |
| Expiry date | Oct 25, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a mechanism is provided for moving relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing blade. A method for bonding is characterized by bonding metal plates by using the above apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.