Ultrasonic vibration soldering apparatus and resonator used therein
US5884833A · kind A · utility
4Cited by
6References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1997 |
| Grant date | Mar 23, 1999 |
| Priority date | — |
| Expiry date | Apr 17, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/0653
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A support portion for attaching a horn main body to a solder tank is provided on the horn main body at a nodal point f2 and ultrasonic vibration from an external transducer is transmitted to solder in the solder tank through the horn main body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.