Ultrasonic bonding method and ultrasonic bonding apparatus
US5884835A · kind A · utility
32Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 1996 |
| Grant date | Mar 23, 1999 |
| Priority date | — |
| Expiry date | Jul 26, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20753
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a case of ultrasonic bonding of a bonding wire to a metal pad provided on a semiconductor substrate, the vibration amplitude of a tip end of the bonding tool is set to be smaller than the film thickness of the metal pad, and the vibration frequency of the bonding tool is set to be higher than 70 kHz. According physical damage, such as cracks produced in a portion beneath the metal pad, can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.