Composition for microetching copper or copper alloy
US5885476A · kind A · utility
18Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1997 |
| Grant date | Mar 23, 1999 |
| Priority date | — |
| Expiry date | Mar 4, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/125
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microetching composition for copper or copper alloys comprising, (a) nitric acid or sulfuric acid, or both, (b) ferric nitrate or ferric sulfate, or both, (c) at least one component selected from a group consisting of unsaturated carboxylic acids, salts of unsaturated carboxylic acid, and anhydrides of unsaturated carboxylic acid, and (d) water. The composition can produce a copper or copper alloy surface exhibiting excellent adhesion to resins such as prepregs and resists and superior solderability. The composition is suitable for the manufacture of printed wiring boards with highly integrated fine line patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.