Laser diode array device for bonding metal plates

US5886313A · kind A · utility

Assignee

• Fraunhofer-Gesellschaft zur förderung der angewandten Forschung e.V. · DE

Inventors

• Volker Krause · Höhr-Grenzhausen, DE
• Konrad Wissenbach · Würselen, DE
• Eckhard Beyer · Alsbach, DE
• Hans-Georg Treusch · Aachen, DE
• Gilbert Vitr · Aachen, DE

Key dates

• Filing date: Jun 5, 1997
• Grant date: Mar 23, 1999
• Expiry date: Jun 5, 2017

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/26
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A device for plating two or more metal plates, strips, etc., by the absoron of laser energy. The device is fitted with beam-forming optics which form the laser radiation into a beam with a rectangular cross-section. The radiation source is a laser-diode array in which several laser diodes are disposed next to each other in the same plane to give bars which can be laid next to each other, as well as stacked one on top of each other, in any numbers. In order to homogenize the laser radiation produced by the array to give a rectangular cross-section, the device proposed is fitted with special optics such as a prism which converges in the shape of a wedge, a glass plate, with a rectangular cross-section, reflective boundary drives, etc. The rectangular cross-section beam heats the two surfaces of the metal plates being plated only locally, over limited areas and to small depths, to the plastic state. In addition, sensors and control devices for control of the power of the laser-diode array and/or for changing the speed of advance of the metal plates being plated may be used.