Leadframe assembly for conducting thermal energy from a semiconductor die disposed in a package
US5886396A · kind A · utility
11Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 1995 |
| Grant date | Mar 23, 1999 |
| Priority date | — |
| Expiry date | Jun 5, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor die (32) is disposed on a heat sink (22) in an electronic package (10). During assembly, a leadframe (20) is connected to the heat sink (22) by down-set tabs (14, 28), which are offset from the heat sink (22) and disposed within the boundary (19) in which the final package (10) will be molded. Individual heat sinks (22) are pre-out prior to molding the final packages (10). In one roach, pins (36) are used to connect down-set tabs (14, 28) to heat sink (22).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.