Integrated circuit compatible electro-optic device using conductive polymer cladding layers
US5887116A · kind A · utility
34Cited by
7References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 11, 1997 |
| Grant date | Mar 23, 1999 |
| Priority date | — |
| Expiry date | Jun 11, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/065
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A commercially attractive arrangement for monolithic integration of a nonlinear optical polymer transverse electro-optic device on an electronic integrated circuit chip. The invention provides for conductive polymer cladding layers immediately adjacent to an optical signal transmitting nonlinear optical polymer core layer. The cladding layers result in a reduced core layer poling voltage, reduced device length, and 5 VDC or less controlling voltage, allowing inclusion into electronic integrated circuit chips of a size compatible with multichip module integration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.