Heat-sensitive mimeograph stencil
US5888653A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 1995 |
| Grant date | Mar 30, 1999 |
| Priority date | — |
| Expiry date | Aug 16, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31801
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A heat-sensitive mimeograph stencil having a uniform shape of openings, which have an excellent balance of retention and permeation of printing ink is disclosed. The heat-sensitive mimeograph stencil includes a polyester film and a porous support made of polyester fibers, which is laminated on the polyester film, wherein the porous support constitutes a network having fused points formed by fusion of the fibers, and that membranes spanning the fibers are formed at some of the fused points, the membranes having thicknesses smaller than average diameter of the fibers. By virtue of this structure, the printed matter obtained by mimeographing using the stencil has high quality and is free from backside transcription. Further, the mimeograph stencil is excellent in ease of transportation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.