Connection leads for an electronic component
US5888848A · kind A · utility
14Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 12, 1998 |
| Grant date | Mar 30, 1999 |
| Priority date | — |
| Expiry date | Jan 12, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Martensitic or austenitic structural-hardening conductive alloy connection leads. Electronic component and fabrication process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.