Process for separating electronic devices

US5888882A · kind A · utility

Assignee

• Deutsche ITT Industries, GmbH · DE

Inventors

• Guenter Igel · Teningen, DE
• Martin Mall · Glückstadt, DE

Key dates

• Filing date: Apr 4, 1997
• Grant date: Mar 30, 1999
• Expiry date: Apr 4, 2017

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S438/948
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A process for separating electronic devices connected with one another in a body, the process including thinning the side of the body remote from the electronic devices, separating the electronic devices, and testing electrical parameters of the electronic devices after the thinning of the body. The handling of the body is improved by applying to the side of the body containing the electronic devices, prior to the thinning process, an electrically nonconductive auxiliary layer in which respective contact openings are formed above the electronic devices to expose the contact(s) of the respective electronic device.