Ultrahigh-frequency electronic component
US5889232A · kind A · utility
9Cited by
2References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 1997 |
| Grant date | Mar 30, 1999 |
| Priority date | — |
| Expiry date | May 13, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.