Radiation shielding of plastic integrated circuits
US5889316A · kind A · utility
53Cited by
2References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 1996 |
| Grant date | Mar 30, 1999 |
| Priority date | — |
| Expiry date | Feb 1, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/953
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A new and improved process by which plastic material forming the plastic body package of an integrated circuit is selectively removed and replaced with a radiation shield having a specific formulation that is customized for a given radiation environment dependent upon the space application in which the integrated circuit is to be used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.