Precision machined warped waveguide wafer
US5889911A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 20, 1994 |
| Grant date | Mar 30, 1999 |
| Priority date | — |
| Expiry date | Sep 20, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/0304
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method of precision machining at least one cut into an article having a non-uniform surface, wherein the cut is of substantially constant depth relative to the non-uniform surface. One aspect of the invention is a machined optical wafer having two adjacent notches, to serve as a platform for a fiber optic pigtail, machined into the edge of the wafer. Another aspect of the invention is a method of automatically machining a plurality of notches into an optical wafer. For optical wafers having embedded light paths, light detected from these light paths may be used to compensate for the variation in embedded depth of the light paths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.