Tool for removing protective encapsulants
US5891257A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 1996 |
| Grant date | Apr 6, 1999 |
| Priority date | — |
| Expiry date | Nov 8, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system for removing protective coatings from a circuit board assembly. The system includes a tool for removing protective coatings from a circuit board assembly. The tool has a flow head, which includes a support, having an opening which is adapted to contact the circuit board assembly and flow solvent to the surface of the circuit board. The flow head may also include a solvent nozzle positioned within the support. The solvent nozzle has an opening adapted to apply solvent to the circuit board assembly. The flow head also includes a solvent recovery volume positioned beneath the support and adjacent to the nozzle. The system also includes a second solvent reservoir, a mechanism for applying heat to the reservoir, and a mechanism for circulating solvent from the reservoir to the flow head and back to the reservoir.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.