Laser processing apparatus and laser processing process
US5891764A · kind A · utility
85Cited by
41References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1996 |
| Grant date | Apr 6, 1999 |
| Priority date | — |
| Expiry date | Oct 30, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/09
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A laser processing process which comprises laser annealing a silicon film 2 .mu.m or less in thickness by irradiating a laser beam 400 nm or less in wavelength and being operated in pulsed mode with a pulse width of 50 nsec or more, and preferably, 100 nsec or more. A laser processing apparatus which comprises a laser generation device and a stage for mounting thereon a sample provided separately from said device, to thereby prevent transfer of vibration attributed to the movement of the stage to the laser generation device and the optical system. A stable laser beam can be obtained to thereby improve productivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.