Heating and cooling apparatus for reaction chamber
US5892207A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 1996 |
| Grant date | Apr 6, 1999 |
| Priority date | — |
| Expiry date | Nov 27, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a temperature regulation apparatus capable of easily regulating the temperature of a support for a substance to be treated, such as a semiconductor wafer. The temperature regulation apparatus includes a liquid nitrogen supply device for supplying liquid nitrogen into a temperature regulation space provided in the inside of a support so as to effect flashing of the liquid nitrogen. A heating device for heating the support and temperature sensors for detecting the temperature of the support are also provided. A temperature setting device sets the temperature of the support at a desired temperature and a controller controls the liquid nitrogen supply device and the heating device based on a temperature detected by the temperature sensors, so that the support reaches and is maintained at the set temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.